Interface modification of SiC-fibre/copper matrix composites by applying a titanium interlayer

Single-fibre push-out tests indicate a very poor adhesion between the SiC fibres and the galvanic copper matrix. To improve the bonding a thin titanium interlayer was deposited on the fibres by magnetron sputtering and heat-treated at 550 °C in vacuum to form TiC with the carbon surface of the SiC fibres. The bonding strength of these composites increased at least tenfold in relation to the material without titanium interlayer.