Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
9809480 | Surface and Coatings Technology | 2005 | 4 Pages |
Abstract
A single-wafer parallel-plate PECVD system was developed using a 40.68 MHz excitation. The wafer temperature is controlled by a helium back side flush avoiding also a deposition at the wafer back side. A stable plasma confined between the electrodes away from the walls of the chamber, an optimised plasma density to get a sufficient deposition rate and good film uniformity, and a controlled wafer temperature which influences the plasma-surface interaction were achieved. Using a SiH4/N2O process and a deposition rate of 1 nm/s a high breakdown voltage â¥Â 6 MV/cm and a refractive index of 1.46 ± 0.015 were obtained. Film thickness uniformity was < 5%. A SF6/O2 process is used for the reactor cleaning with etching rates of about 1 nm/s.
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Physical Sciences and Engineering
Materials Science
Nanotechnology
Authors
K. Schade, F. Stahr, S. Röhlecke, O. Steinke, R.H. Richter, F. Schopper, K. Heinzinger, J. Hartung,