| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 9809586 | Surface and Coatings Technology | 2005 | 5 Pages |
Abstract
The paper presents a solution for improving the quality of the surface generated during deep wet etching of glass using an HF (49%)/HCl (37%) solution in a volumetric ratio 10:1. Pyrex glass (Corning 7740) and soda lime glass were analyzed. In addition, the characterization of the main masking layers, including photoresist, amorphous silicon, polysilicon and Cr/Au for deep wet etching in the optimal solution, is described.
Related Topics
Physical Sciences and Engineering
Materials Science
Nanotechnology
Authors
Ciprian Iliescu, Ji Jing, Francis E.H. Tay, Jianmin Miao, Tietun Sun,