Article ID Journal Published Year Pages File Type
9812267 Thin Solid Films 2005 5 Pages PDF
Abstract
Electrical contacts of NiSi0.82Ge0.18 to p+-Si0.82Ge0.18 were fabricated and characterised. Lateral growth of the NiSi0.82Ge0.18 under SiO2 isolation was observed. A three-dimensional model was employed to extract the contact resistivity by considering both the lateral growth and the presence of a recessed NiSi0.82Ge0.18 step into the Si0.82Ge0.18. The contact resistivity extracted was 5.0 × 10− 8 and 1.4 × 10− 7 Ω cm2 for small contacts of circular geometry and large contacts of square shape, respectively. Possible causes responsible for this 3-fold difference in contact resistivity were discussed. An underestimate of the contact resistivity by 35% was found if a two-dimensional model was used without taking into account the complex interface morphology.
Related Topics
Physical Sciences and Engineering Materials Science Nanotechnology
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