Article ID Journal Published Year Pages File Type
9812627 Thin Solid Films 2005 6 Pages PDF
Abstract
In this article, a chemical kinetics mechanism was proposed for the chemical mechanical polishing (CMP) system of mixed-abrasive slurry. Under the consideration of a pad as a sort of catalyst, a polishing rate equation was deduced. Compared to the previous equations, the present equation is in terms of the abrasive concentration. With the limited experimental data, the present equation may work for describing the CMP mechanism.
Related Topics
Physical Sciences and Engineering Materials Science Nanotechnology
Authors
, , ,