Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
9812677 | Thin Solid Films | 2005 | 6 Pages |
Abstract
Nitrogen incorporation into hard fluorinated carbon films deposited by rf-plasma decomposition of CH4-CF4-N2 mixtures was studied as a function of the self-bias voltage. The self-bias voltage, Vb, which was controlled by the rf power input, ranged from â100 to â600 V. The structural and chemical characterization of the films was performed by Raman spectroscopy, X-ray photoelectron spectroscopy (XPS), and ion beam analysis (IBA). The film hardness was measured by nanoindentation and the internal stress determined from the bending of the substrate. The friction behavior was investigated by atomic force microscopy in lateral force mode. The film composition and the chemical ambient of carbon and nitrogen atoms were independent of Vb as revealed by IBA and XPS, respectively. In particular, the absence of F-rich CFn groups, together with the low H and F content, suggests a high degree of interconnectivity of the film network in agreement with hardness and stress values. Raman results suggest that polymer-like films were obtained at â100 V and that more graphitic structures were obtained for films deposited at â600 V. The atomic density, hardness and internal stress are strongly dependent on the self-bias voltage, presenting a broad maximum in the range of â270 and â420 V. These results confirm the importance of the ion bombardment during film growth on the mechanical properties of the films. The friction coefficient was independent of the self-bias voltage.
Keywords
Related Topics
Physical Sciences and Engineering
Materials Science
Nanotechnology
Authors
M.E.H. Maia da Costa, C.M.T. Sanchez, L.G. Jacobsohn, F.L. Jr,