Cross-linked polyimide-polythiophene composite films with reduced surface resistivities

Composite polyimide thin films with reduced surface resistivities were prepared using preformed and soluble hydroxyl polyimide (HPI) and polythiophene acetic acid (PTAA). Casting of blends and layer-by-layer assembly were employed to fabricate the thin films. In either technique, HPI and PTAA chains are cross-linked through ester formation, giving rise to thermal and mechanical robustness. Fourier transform infrared spectroscopy, X-ray photoelectron spectroscopy and Ultraviolet-visible absorption spectroscopy were used to investigate the formation of the composite films. Surface resistivity measurements showed that the values were well-suited for antistatic applications. The composite structures also showed good stability to thermal and ambient environments.