Quantitative analysis of electrodeposited tin film morphologies by atomic force microscopy

This study of the electrodeposition of tin on steel substrates demonstrates that it is possible to obtain quantitative information on the thin film growth at industrially relevant substrates using atomic force microscopy (AFM) to monitor the film morphology and X-ray fluorescence (XRF) to measure the average film thickness. The effects of current density and electrolyte temperature on the film morphology, surface roughness, and grain size distribution (GSD) are reported. While the roughness of the substrates used in this study can vary by several hundred nanometers to a micrometer, we are interested in quantitative characterization of the tin films with thickness varying from a few tens of nanometers to several hundred nanometers. This study shows that for the range of film thickness and length scale studied, analysis of the AFM images can provide quantitative characterization of the thin film roughness and grain size distribution at various stages of growth with little interference from the substrate morphological inhomogeneities.