Heterostructures GexSi1−x/Si(0 0 1) grown by low-temperature (300-400 °C) molecular beam epitaxy: Misfit dislocation propagation

The dislocation velocity is estimated by the measuring of the length of misfit dislocations observed in annealed films. Additionally a method for estimating the mean threading dislocation glide velocity is used, which involves the measured threading dislocation density in a particular film and degree of its plastic relaxation directly related to the number of threading dislocations and their glide velocity. It is shown that dislocation glide velocities in heterostructures grown with the use of the low-temperature Si buffer and at low-temperatures are higher than the values predicted by the classical calculations by an order of magnitude.