Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
9834627 | Journal of Magnetism and Magnetic Materials | 2005 | 5 Pages |
Abstract
We studied the atomic relocation in Ni-Cu and Co-Cu multilayers under Ar+ bombardment, using molecular dynamics simulations. The atomistic mechanisms upon impact are significantly different for the two systems, especially on the monolayer scale: Ar bombardment of Co on Cu is found to lead to dewetting, while bombardment of Ni on Cu is found to lead mostly to formation of an interfacial alloy due to relocated atoms.
Related Topics
Physical Sciences and Engineering
Physics and Astronomy
Condensed Matter Physics
Authors
J.C.S. Kools, K. Williams, A. Hayes,