Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
9844867 | Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment | 2005 | 7 Pages |
Abstract
This paper presents the first results on a prototype of a large-area X-ray imaging device made out of hybrid CMOS pixel detectors. The challenges of manufacturing and implementing imaging devices on an area larger than the single component size, with a seamless sensitive area, are addressed via a preliminary evaluation of the images. A sensitive area of approximately 6Ã3 cm2 was built with eight single ASIC chips performing photon counting and bump-bonded to two high-resistivity p-n silicon sensors working in a reverse bias mode. Each chip consists of 256Ã256 identical square pixels of 55 μm side. The image delivered is a 1024Ã512-pixel matrix. Dedicated read-out electronics, software and mechanical supports have been developed. We report and discuss the challenges of the system in terms of the resulting quality of static images obtained with a 70 kV X-ray tube.
Related Topics
Physical Sciences and Engineering
Physics and Astronomy
Instrumentation
Authors
J. Chaput, M. Caria, F. Laverroux, B. Surre, J. Maublant,