Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
9845374 | Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment | 2005 | 5 Pages |
Abstract
The new “3-D” detector architecture, first proposed in 1997 [IEEE Trans. Nucl. Sci. 45(3) (1998) 751], has significant advantages over standard planar technology in a wide range of applications, e.g. in high-energy physics, synchrotron radiation detection and medical imaging. In 3-D detectors, unlike standard planar technology, the electrodes, as illustrated in Fig. 1, traverse the detector bulk. A 64Ã64 pixel 3-D detector designed for read out using a Medipix1 chip has been fabricated in silicon. The sensors have been characterised and the initial test results are presented in this paper.
Keywords
Related Topics
Physical Sciences and Engineering
Physics and Astronomy
Instrumentation
Authors
V.A. Wright, W.D. Davidson, J.J. Melone, V. O'Shea, K.M. Smith, L. Donnohue, L. Lea, K. Robb, S. Nenonen, H. Silpila,