| Article ID | Journal | Published Year | Pages | File Type | 
|---|---|---|---|---|
| 9845374 | Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment | 2005 | 5 Pages | 
Abstract
												The new “3-D” detector architecture, first proposed in 1997 [IEEE Trans. Nucl. Sci. 45(3) (1998) 751], has significant advantages over standard planar technology in a wide range of applications, e.g. in high-energy physics, synchrotron radiation detection and medical imaging. In 3-D detectors, unlike standard planar technology, the electrodes, as illustrated in Fig. 1, traverse the detector bulk. A 64Ã64 pixel 3-D detector designed for read out using a Medipix1 chip has been fabricated in silicon. The sensors have been characterised and the initial test results are presented in this paper.
											Keywords
												
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											Authors
												V.A. Wright, W.D. Davidson, J.J. Melone, V. O'Shea, K.M. Smith, L. Donnohue, L. Lea, K. Robb, S. Nenonen, H. Silpila, 
											