| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 9845684 | Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment | 2005 | 7 Pages |
Abstract
Yield maximization in multichip hybrid pixel sensors is a crucial issue in large volume productions planned for future High-Energy Physics experiments. Bump bonding process optimization can guarantee statistical single bump failure rates at the acceptable level of 10-100Â ppm; nevertheless, systematic effects connected to process repeatability can affect the functionality of a full chip in a module to a much larger extent. Because of this, the reversibility of the bonding procedure has been investigated. A feasibility study on single chip assemblies for the ATLAS experiment has been successfully completed, proving the possibility of reworking. As a result of it, a dedicated facility has been conceptually designed, engineered and commissioned. The characteristics of the facility in terms of motion, temperature and tensile strength control are outlined, together with the main results.
Related Topics
Physical Sciences and Engineering
Physics and Astronomy
Instrumentation
Authors
A. Airoldi, G. Alimonti, M. Amati, A. Andreazza, A. Bulgheroni, M. Caccia, D. Giugni, W. Kucewicz, T. Lari, C. Meroni, F. Ragusa, C. Troncon, G. Vegni,