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Daneshyari Hardware and Architecture Journas Latest Articles

Hardware and Architecture Research Articles

Testing semiconductor devices at extremely high operating temperatures
Fulltext Access 4 Pages 2008
Anomalous narrow width effect in p-channel metal–oxide–semiconductor surface channel transistors using shallow trench isolation technology
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Near-field detection of photon emission from silicon with 30 nm spatial resolution
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Optimisation of a thick-film 10–400 N force sensor
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Dynamic stress method for accurate NVM oxide robustness evaluation for automotive applications
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Electro-ultrasonic spectroscopy of polymer-based thick film layers
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Intermittent-contact scanning capacitance microscopy versus contact mode SCM applied to 2D dopant profiling
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Analysis of traps effect on AlGaN/GaN HEMT by luminescence techniques
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Microsystems elements based on free-standing thick-films made with a new sacrificial layer process
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Study of copper drift during TDDB of intermetal dielectrics by using fully passivated MOS capacitors as test vehicle
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PMOS breakdown effects on digital circuits – Modeling and analysis
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Statistical simulation of random dopant induced threshold voltage fluctuations for 35 nm channel length MOSFET
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Synthesis of SrAl2O4: Eu2+, Dy3+, Gd3+ phosphor by combustion method and its phosphorescence properties
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Experimental evidence of “latent gate oxide damages” in medium voltage power MOSFET as a result of heavy ions exposure
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High performance, FPGA-based test apparatus for unclamped inductive switching of IGBTs
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MIMC reliability and electrical behavior defined by a physical layer property of the dielectric
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3D electro-thermal investigations for reliability of ultra low ON state resistance power MOSFET
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Statistical aspects of reliability in bulk MOSFETs with multiple defect states and random discrete dopants
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Reduction of test effort. Looking for more acceleration for reliable components for automotive applications
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Thermal heating within SOI
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New aspects for lifetime prediction of bipolar transistors in automotive power wafer technologies by using a power law fitting procedure
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Low-cost preparation method for exposing IC surfaces in stacked die packages by micro-abrasive blasting
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Detection of failure sites by focused ion beam and nano-probing in the interconnect of three-dimensional stacked circuit structures
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Nanometer-scale leakage measurements in high vacuum on de-processed high-k capacitors
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Hot spot analysis during thermal shutdown of SOI BCDMOS half bridge driver for automotive applications
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Failure Analysis enhancement by evaluating the Photoelectric Laser Stimulation impact on mixed-mode ICs
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Acceleration factors for THB induced degradation of AlGaAs/InGaAs pHEMT devices
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Effects of aluminum incorporation on hafnium oxide film using plasma immersion ion implantation
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Fracture morphology and mechanism of IMC in Low-Ag SAC Solder/UBM (Ni(P)-Au) for WLCSP
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Influence of the organic pollution on the reliability of HE9 connectors
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Optimization of gate poly TAB size and reliability on short channel pMOSFET
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Yield challenges in wafer stacking technology
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Significantly improving sub-90 nm CMOSFET performances with notch-gate enhanced high tensile-stress contact etch stop layer
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Voltage acceleration of time dependent breakdown of ultra-thin NO and NON dielectrics
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Improved performances of a two-step passivated heterojunction bipolar transistor
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Impact of inside spacer process on fully self-aligned 250 GHz SiGe:C HBTs reliability performances: a-Si vs. nitride
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Sulfur-contamination of high power white LED
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InGaP/GaAs heterojunction bipolar transistor and RF power amplifier reliability
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Effect of a trace of water vapor on Ohmic contact formation for AlGaN/GaN epitaxial wafers
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Effects of continuously applied stress on tin whisker growth
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Tensile tests of micro anchors anodically bonded between Pyrex glass and aluminum thin film coated on silicon wafer
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High-temperature performance of AlGaN/GaN HFETs and MOSHFETs
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ESD failure signature in capacitive RF MEMS switches
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Diffusion barrier performance of Zr–N/Zr bilayered film in Cu/Si contact system
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Alpha particle radiation effects in RF MEMS capacitive switches
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Investigation of diode geometry and metal line pattern for robust ESD protection applications
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A unification of interface-state generation and hole-injection for hot-carrier-injection stress in low and high-voltage NMOSFET
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Impact of silicon nitride CESL on NLDEMOS transistor reliability
Fulltext Access 5 Pages 2008
An analytical model for hot carrier degradation in nanoscale CMOS suitable for the simulation of degradation in analog IC applications
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Improved upper contacts PMMA on P3HT PTFTS using photolithographic processes
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Reliability and defectivity comparison of n- and p-channel SLS ELA polysilicon TFTs fabricated with a novel crystallization technique
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Effect of the pre-gate oxide cleaning temperature on the reliability of GOI and devices performances in deep submicron CMOS technology
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Failure analysis of a thin-film nitride MEMS package
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A four-point-bending-test for the stability assessment of glass frit bonded molded microsensors
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Packaging influences on the reliability of MEMS resonators
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Dependency of thermal spreading resistance on convective heat transfer coefficient
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RF CMOS reliability simulations
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Generic simulator for faulty IC
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Study of temperature dependent properties of organic substrate materials
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Evaluation of conductive-to-resistive layers interaction in thick-film resistors
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The self-formatting barrier characteristics of Cu–Mg/SiO2 and Cu–Ru/SiO2 films for Cu interconnects
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Piezoelectric polymer films as power converters for human powered electronics
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IGBT modules robustness during turn-off commutation
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Highly reliable processes for embedding discrete passive components into organic substrates
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A MEMS-based wireless multisensor module for environmental monitoring
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Quality factor measurement of micro gyroscope structure according to vacuum level and desired Q-factor range package method
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A fringing-capacitance model for deep-submicron MOSFET with high-k gate dielectric
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Reliability improvement of InGaN LED backlight module by accelerated life test (ALT) and screen policy of potential leakage LED
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Detectability of dynamic photon emission in static Si CCD for signal path determination in integrated circuits
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On chip–package stress interaction
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Determination of temperature change inside IC packages during laser ablation of molding compound
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Silicon based system in package: Improvement of passive integration process to avoid TBMS failure
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Unusual defects, generated by wafer sawing: Diagnosis, mechanisms and how to distinguish from related failures
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Voltage and temperature effect on dielectric charging for RF-MEMS capacitive switches reliability investigation
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Kelvin probe microscopy for reliability investigation of RF-MEMS capacitive switches
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Temperature stability of a piezoresistive MEMS resonator including self-heating
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Negative bias temperature instability in n-channel power VDMOSFETs
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Degradation behavior of Ta2O5 stacks and its dependence on the gate electrode
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Laser decapsulation of plastic packages for failure analysis: Process control and artefact investigations
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Reliability aspects of a radiation detector fabricated by post-processing a standard CMOS chip
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Evaluation of RF electrostatic discharge (ESD) protection in 0.18-μm CMOS technology
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A wafer-level approach to device lifetesting
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Effect of crystallographic defects on the reverse performance of 4H–SiC JBS diodes
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Negative bias temperature instability (NBTI) recovery with bake
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Novel simulation approach for transient analysis and reliable thermal management of power devices
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Comparison of laser voltage probing and mapping results in oversized and minimum size devices of 120 nm and 65 nm technology
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PLL soft functional failure analysis in advanced logic product using fault based analogue simulation and soft defect localization
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Thermal storage effects on AlGaN/GaN HEMT
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Electrical characterization and reliability study of HEMTs on composite substrates under high electric fields
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Fast electromigration wafer mapping for wafer fab process monitoring and improvement
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Determination of migration effects in Cu-via structures with respect to process-induced stress
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Simulation of migration effects in nanoscaled copper metallizations
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Reliability study of TaON capacitors: From leakage current characterization to ESD robustness prediction
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Non-linear width scaling of ESD protection devices and link with p-well implant in BCD-processes
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ESD sensitivity investigation on a wide range of high density embedded capacitors
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IGBT module failure analysis in railway applications
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Behaviour of 1.2 kV SiC JBS diodes under repetitive high power stress
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Automotive IC reliability: Elements of the battle towards zero defects
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Thermal modeling of high frequency DC–DC switching modules: Electromagnetic and thermal simulation of magnetic components
Fulltext Access 5 Pages 2008
Defect analysis concerning variation in characteristics of PIN diode for Hybrid Vehicles
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