| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 10282846 | Building and Environment | 2005 | 5 Pages |
Abstract
The aim of the study was to examine how the thickness and heat-treatment of cladding boards affects cupping during cyclic conditions. The study was conducted with heat-treated and non-heat-treated cladding boards in laboratory conditions. On the basis of the results, thickness and heat-treatment both have a significant influence on cupping of the board. The cupping of heat-treated board was considerably lower than that of non-heat-treated board.
Related Topics
Physical Sciences and Engineering
Energy
Renewable Energy, Sustainability and the Environment
Authors
Jari Virta,