| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 10322554 | Expert Systems with Applications | 2012 | 9 Pages |
Abstract
⺠This study is to develop a new FVCP to recognize defect patterns, and predict the wafer yield by ACO-BPNN. ⺠The proposed FVCP is helpful in improving the accuracy of the wafer yield model. ⺠The proposed model can help the IC manufacturers to evaluate their process capability in relation to profit and loss.
Related Topics
Physical Sciences and Engineering
Computer Science
Artificial Intelligence
Authors
Jun-Shuw Lin,