| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 10376420 | Journal of Colloid and Interface Science | 2012 | 6 Pages |
Abstract
⺠Covalent assembly of silver nanoparticles on a oxide-free silicon surface is illustrated. ⺠Alkenyl terminals of AgNPs facilitate their assembly through heat-induced hydrosilylation. ⺠Mild temperature hydrosilylation impede the fusion of silver nanoparticles. ⺠Developed facile approach promises potential for electronic devices and solar cells.
Related Topics
Physical Sciences and Engineering
Chemical Engineering
Colloid and Surface Chemistry
Authors
Om P. Khatri, Takashi Ichii, Kuniaki Murase, Masayuki Kanehara, Toshiharu Teranishi, Hiroyuki Sugimura,