Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
10406973 | Materials Science in Semiconductor Processing | 2016 | 5 Pages |
Abstract
An alternative technique for production of devices which uses both silicon crystalline wafers (p-type) and heavy doped amorphous silicon thin films (n-type) is reported. The amorphous silicon acts as a finite source of dopant and is deposited (at low temperature, 70 °C) by plasma enhanced chemical vapor deposition on silicon wafers. Afterwards, the process of dopant diffusion into the crystalline silicon occurs in a diffusion furnace at 1000 °C for 2 h, to create p-n junctions. Using SIMS analyses, a dopant (P) transfer into c-Si of about 30% is verified and 87% of the dopant transferred is electrically active. Consequently, n-MOSFET devices are produced using a gate oxide thermally grown at the same diffusion temperature for one hour. The preliminary results of the MOSFET (channel length and width of 0.5 and 5 mm, respectively) show a depletion behavior with a threshold voltage, Vth=â8.2 V and afield-effect mobility, µFE=187.8 cm2/(Vs).
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Authors
L. Ricardo, A. Amaral, C. Nunes de Carvalho, G. Lavareda,