| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 10671043 | Thin Solid Films | 2005 | 5 Pages |
Abstract
Quantitative evidence of significantly improved interfacial adhesion between Au films and SiOx/Si substrates induced by an organic dendrimer monolayer was presented. For dendrimer-mediated Au films, nanoscratch tests revealed a critical load that was two times higher than that for films without dendrimer mediation. Atomic force microscopy (AFM) examination of nanoindents revealed much constrained lateral flow of metals in the dendrimer-mediated Au films during nanoindentation, indicating enhanced adhesion due to the presence of the dendrimer layer.
Keywords
Related Topics
Physical Sciences and Engineering
Materials Science
Nanotechnology
Authors
Xiao Li, Feng Huang, M. Curry, S.C. Street, M.L. Weaver,