Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
10673397 | CIRP Annals - Manufacturing Technology | 2015 | 4 Pages |
Abstract
This study investigates diamond scratching at a high speed comparable to that in a grinding process on an ultraprecision grinder. Diamond tips are prepared for the study. The scratched silicon wafer is observed for changes in the surface layer with transmission electron microscopy. The observation discovers that an amorphous layer is formed on top of the pristine Si-I phase before the onset of chip formation. This discovery is different from the previous findings in which a damaged silicon layer is identified underneath the amorphous layer. Furthermore, no high pressure phase is found before the onset of chip formation.
Keywords
Related Topics
Physical Sciences and Engineering
Engineering
Industrial and Manufacturing Engineering
Authors
Zhenyu Zhang, Bo Wang, Renke Kang, Bi Zhang, Dongming Guo,