Preparation and thermal characterization of composite “Paraffin/Red Brick” as a novel form-stable of phase change material for thermal energy storage

•Paraffin/Red Brick composite is prepared using dispersion method.•The maximum mass fraction of Pa retained in Br was found as 40 wt% without the leakage.•Phase change temperature and latent heat is measured to be 52.73 °C and 41.32 J/g.•The addition of quantity of EG enhances the heat conduction in the composite.•The Paraffin/Red Brick composte has great potential in the application of building.

This study is focused on the preparation and characterization of thermal properties and thermal reliability of Paraffin (Pa)/Red Brick (Br) composite as form-stable phase change material (PCM). The maximum mass fraction of Pa retained in Br was found as 40 wt% without the leakage of Pa, in melted state even when it's heated over the melting point of Pa. The materials used, red brick powder (Br), paraffin (Pa), expanded graphite (EG) and PCM composite are characterized by Laser Particle Size, by Environmental Scanning Electron Microscopy and Spectroscopy Infrared Fourier Transform. The thermo-physical properties of composites MCPs are studied by Differential Scanning Calorimetry. The results show that the composite to form stabilized prevents leakage of the phase change material from the matrix. The surface of the clay matrix is fully charged paraffin by a physical attraction. The FT-IR analysis shows that there is no chemical reaction between the matrix and the MCP. From differential scanning calorimetry (DSC) analysis, the melting and freezing temperatures and latent heats of the form-stable PCM were measured as 52.73 °C and 55.8 °C and 41.32 J/g and 42.39 J/g. Thermal conductivity of form-stable Pa/Br/EG (10%) composite (0.52 Wm−1K−1) was found to be 3 times higher than that of pure Pa (0.1716 Wm−1K−1). Based on all results, it was concluded that the form-stable Pa/EG (40/60 w/w%) has considerable latent heat energy storage potential because of its good thermal properties, thermal and chemical reliability and thermal conductivity.