Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
1282356 | International Journal of Hydrogen Energy | 2012 | 14 Pages |
Pd–Cu composite membranes on microporous stainless steel (MPSS) substrate were fabricated using surfactant induced electroless plating (SIEP). In the SIEP method, dodecyl trimethyl ammonium bromide (DTAB), a cationic surfactant, was used in Pd- and Cu-baths for the sequential deposition of metals on MPSS substrates. The SIEP Pd–Cu membrane performance was compared with membranes fabricated by conventional electroless plating (CEP). The pre- and post-annealing characterizations of these membranes were carried out by SEM, XRD, EDX and AFM studies. The SEM images showed a significant improvement of the membrane surface morphology, in terms of metal grain structures and grain agglomeration compared to the CEP membranes. The SEM images and helium gas-tightness studies indicated that dense and thinner films of Pd–Cu can be produced with shorter deposition time using SIEP method. From XRD, cross-sectional SEM and EDS studies, alloying of Pd–Cu was confirmed at an annealing temperature of 773 K under hydrogen environment. These membranes were also studied for H2 perm-selectivity as a function of temperature and feed pressure. SIEP membranes had significantly higher H2 perm-selectivity compared to CEP membranes. Under thermal cycling (573 K – 873 K – 573 K), the SIEP Pd–Cu membrane was stable and retained hydrogen permeation characteristics for over three months of operation.
► Pd–Cu membrane on microporous stainless steel support was fabricated by a novel electroless plating technique. ► Post-annealed polycrystalline Pd–Cu film reveals alloying of Pd–Cu. ► Pd–Cu film is hydrogen selective. ► The membrane retained hydrogen permeation characteristics under long-term thermal cycling.