| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1523337 | Materials Chemistry and Physics | 2012 | 4 Pages |
Abstract
⺠The intermetallic compound, Al2Cu, has similar resistivity with Ni. ⺠The growth of the intermetallic compound, Al2Cu, detours the current paths and reduces the current crowding. ⺠A mathematic model successfully predicts the occurrence of early failure in the samples, based on the methodology. ⺠Simulation results proved the experimental phenomena and the mathematic analyses.
Related Topics
Physical Sciences and Engineering
Materials Science
Electronic, Optical and Magnetic Materials
Authors
C.Y. Tsai, B.Y. Lou, H.H. Hsu, Albert T. Wu,