Prediction of a new leveler (N-butyl-methyl piperidinium bromide) for through-hole electroplating using molecular dynamics simulations

Adsorption behaviors of N-butyl-methyl piperidinium bromide (PP14Br) at Cu (001) surface under different electric fields were investigated using molecular dynamics (MD) simulations. We predicted PP14Br could be used as a new leveler for through-hole copper electroplating. In the through-hole electroplating experiments, PP14Br was employed as a leveler. The results of electroplating confirmed the prediction. The electrochemical tests were characterized by potentiodynamic polarization and galvanostatic measurements using rotating disk electrode operated at 100 and 1000 rpm.

► A new leveler (PP14Br) for through-hole electroplating is found. ► Study the adsorption behavior of PP14Br using molecular dynamic (MD) simulations. ► Predict the leveler using MD simulations and confirm it through experiments.