Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
181208 | Electrochemistry Communications | 2009 | 5 Pages |
A rod-like 1-dodecanethiol film assisted with the preferential adhesion of polydopamine was prepared on the non-etching copper surfaces by a simple dip-coating method. The formation and surface structure of the film were characterized by water contact angle measurement, scanning electron microscopy (SEM), and X-ray photoelectron spectroscopy (XPS). Once the 1-dodecanethiol film formed on the polydopamine-coated copper surface, the hydrophilic surface changed to hydrophobic. The corrosion behavior of the functional films was evaluated by the electrochemical impedance spectroscopy (EIS). The excellent corrosion resistance property could be ascribed to the compact film structure and good seawater stability for modified copper surface, especially in limiting the infiltration of Cl−.