Article ID Journal Published Year Pages File Type
181208 Electrochemistry Communications 2009 5 Pages PDF
Abstract

A rod-like 1-dodecanethiol film assisted with the preferential adhesion of polydopamine was prepared on the non-etching copper surfaces by a simple dip-coating method. The formation and surface structure of the film were characterized by water contact angle measurement, scanning electron microscopy (SEM), and X-ray photoelectron spectroscopy (XPS). Once the 1-dodecanethiol film formed on the polydopamine-coated copper surface, the hydrophilic surface changed to hydrophobic. The corrosion behavior of the functional films was evaluated by the electrochemical impedance spectroscopy (EIS). The excellent corrosion resistance property could be ascribed to the compact film structure and good seawater stability for modified copper surface, especially in limiting the infiltration of Cl−.

Related Topics
Physical Sciences and Engineering Chemical Engineering Chemical Engineering (General)
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