Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
417513 | Computational Statistics & Data Analysis | 2013 | 13 Pages |
Abstract
Deposition of silicon dioxide (SiO22) is a critical step of integrated circuit manufacturing; hence it is monitored during the manufacturing process at a grid of points defined on the wafer area. Since collecting thickness measurements is expensive, it is a compelling issue to investigate how a sub grid can be identified. A strategy based on spatial prediction and simulating annealing is proposed to tackle the problem which proved to be effective when applied to a real process. A diagnostic device for monitoring the deposition process is also discussed which can be usefully adopted in the day-to-day activity by practitioners acting in process control of a microelectronics fab.
Related Topics
Physical Sciences and Engineering
Computer Science
Computational Theory and Mathematics
Authors
Riccardo Borgoni, Luigi Radaelli, Valeria Tritto, Diego Zappa,