| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 447956 | AEU - International Journal of Electronics and Communications | 2007 | 5 Pages |
Abstract
A SOI-based optical board technology is presented. Hybrid integration combines the strength of silicon and InP. The SOI board provides passive optical components and acts as the mounting platform. Adapted active III/V devices are integrated using Au/Sn solder technology and passive alignment. Precise mounting of lasers on the board is necessary to ensure low coupling losses.
Related Topics
Physical Sciences and Engineering
Computer Science
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Authors
Jürgen Bruns, Torsten Mitze, Martin Schnarrenberger, Lars Zimmermann, Karsten Voigt, Martina Krieg, Jochen Kreißl, Klemens Janiak, Thorsten Hartwich, Klaus Petermann,