Article ID Journal Published Year Pages File Type
458335 Journal of Systems and Software 2016 15 Pages PDF
Abstract

•A thermal-aware real-time scheduling framework for 3D multicore chips is proposed.•A thermal size assignment is used to manage the heat generated by task executions.•The thermal-throttling server handles run-time temperature management.•The thermal-throttling real-time dispatchers are presented.•The admission control ensures that all tasks meet the timing and thermal constraints.

Three-dimensional (3D) multicore chips have been recently developed to deal with the power consumption and interconnection delay problems of embedded systems; however, thermal management has proven to be challenging due to the heat effect of vertically stacked cores, and the subsequent trade-off that occurs between performance requirements and overheating. In this paper we propose a novel thermal-aware real-time scheduling framework for 3D multicore chips to achieve an effective trade-off between system temperature and task schedulability for dynamic workloads. A thermal-throttling server is first proposed to adjust the heat generated by task executions, and a thermal-throttling dispatcher is then presented to enable thermal-awareness in well-known real-time dispatchers. An admission control is subsequently derived to ensure that all task executions satisfy the thermal and timing constraints. Lastly, a series of extensive simulations are carried out, with encouraging results in terms of schedulability and the prevention of overheating.

Related Topics
Physical Sciences and Engineering Computer Science Computer Networks and Communications
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