Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
479228 | European Journal of Operational Research | 2007 | 11 Pages |
Abstract
This paper studies the defect data analysis method for semiconductor yield enhancement. Given the defect locations on a wafer, the local defects generated from the assignable causes are classified from the global defects generated from the random causes by model-based clustering, and the clustering methods can identify the characteristics of local defect clusters. The information obtained from this method can facilitate process control, particularly, root-cause analysis. The global defects are modeled by the spatial non-homogeneous Poisson process, and the local defects are modeled by the bivariate normal distribution or by the principal curve.
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Physical Sciences and Engineering
Computer Science
Computer Science (General)
Authors
Jung Yoon Hwang, Way Kuo,