Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
4953915 | AEU - International Journal of Electronics and Communications | 2017 | 15 Pages |
Abstract
The DC and microwave characteristics of Lg = 50 nm T-gate InAlN/AlN/GaN High Electron Mobility Transistor (HEMT) on SiC substrate with heavily doped n+ GaN source and drain regions have demonstrated using Synopsys TCAD tool. The proposed device features an AlN spacer layer, AlGaN back-barrier and SiN surface passivation. The proposed HEMT exhibits a maximum drain current density of 1.8 A/mm, peak transconductance (gm) of 650 mS/mm and ft/fmax of 118/210 GHz. At room temperature, the measured carrier mobility, sheet charge carrier density (ns) and breakdown voltage are 1195 cm2/Vs, 1.6 Ã 1013 cmâ2 and 18 V respectively. The superlatives of the proposed HEMTs are bewitching competitor for future monolithic microwave integrated circuits (MMIC) applications particularly in W-band (75-110 GHz) high power RF applications.
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Authors
P. Murugapandiyan, S. Ravimaran, J. William,