| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 4982013 | Colloids and Surfaces A: Physicochemical and Engineering Aspects | 2017 | 6 Pages |
â¢A new low temperature technique to prepare gold films on the dielectric surfaces is developed.â¢Gold-copper phosphide coating is obtained by adding copper chloride.â¢Thickness of the coating depends on the concentration of the gold chloride solution.â¢Diamond particles are incorporated into the gold coating to improve surface and mechanical properties of the coating.
The technology of applying the gold film on the dielectric surface, based on the low-temperature reduction of the superficial sorption layer of gold chloride by phosphine gas, was developed. The sorption layer was obtained by immersing the product in a solution of gold chloride. The thickness of the coating depended on the concentration of the gold chloride solution. Adding copper chloride a film of gold-copper phosphide can be obtained. To give functional properties to the film, non-metallic particles were incorporated in the film. So when diamond particles sprayed on the wetted gold chloride surface, a gold-diamond coating was obtained containing 4.25% of diamond.
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