| Article ID | Journal | Published Year | Pages | File Type | 
|---|---|---|---|---|
| 4990400 | Applied Thermal Engineering | 2017 | 8 Pages | 
Abstract
												We also developed a device for the measurement of thermal diffusivity based on the Angstrom method. We then measured (under experimental conditions) the thermal diffusivity of four pure metals for comparison with standard reference values. The thermal diffusivity values were measured as follows: VC (44.04 cm2/s) and copper plate (1.219 cm2/s).
											Related Topics
												
													Physical Sciences and Engineering
													Chemical Engineering
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											Authors
												Chien Huang, Wei-Keng Lin, Jhe-Kai Chen, 
											