Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
4992219 | Applied Thermal Engineering | 2016 | 38 Pages |
Abstract
Copper-tin (Cu-Sn) intermetallic alloy coating was developed on mild steel substrate by galvanostatic electrodeposition technique from sulfate-based acidic electrolyte containing Laprol as additive. The homogenous coating containing cubic δ phase with composition of 32.6% Sn was obtained, when a current of â8.5 mA was made to flow through the electrochemical bath. The optimized coating with thickness of â¼0.4-3 μm exhibits â¼80% specular reflectance. The coating has a hardness of 2.6 GPa, suggesting a good scratch resistance property. The experimental results also suggest that the hydrophobic surface of Cu-32.6% Sn thin film can be potentially used as an attractive coating for solar reflector application under dusty and humid conditions.
Keywords
Related Topics
Physical Sciences and Engineering
Chemical Engineering
Fluid Flow and Transfer Processes
Authors
Sherine Alex, Bikramjit Basu, Sanchita Sengupta, Upendra K. Pandey, Kamanio Chattopadhyay,