Article ID Journal Published Year Pages File Type
4992219 Applied Thermal Engineering 2016 38 Pages PDF
Abstract
Copper-tin (Cu-Sn) intermetallic alloy coating was developed on mild steel substrate by galvanostatic electrodeposition technique from sulfate-based acidic electrolyte containing Laprol as additive. The homogenous coating containing cubic δ phase with composition of 32.6% Sn was obtained, when a current of −8.5 mA was made to flow through the electrochemical bath. The optimized coating with thickness of ∼0.4-3 μm exhibits ∼80% specular reflectance. The coating has a hardness of 2.6 GPa, suggesting a good scratch resistance property. The experimental results also suggest that the hydrophobic surface of Cu-32.6% Sn thin film can be potentially used as an attractive coating for solar reflector application under dusty and humid conditions.
Related Topics
Physical Sciences and Engineering Chemical Engineering Fluid Flow and Transfer Processes
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