| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 514883 | Finite Elements in Analysis and Design | 2006 | 6 Pages |
Abstract
In the present study, we consider the bonding process of a pair of wafers with rough surfaces via an energy-rate concept in which “rate” refers to “area rate”. A finite element numerical simulation for a rough surface with periodical distributed asperities bonded onto a rigid half-space is carried out for demonstrating the energy-rate concept. The simulation reveals various phenomena in the wafer bonding, such as self-activated bonding, asperity shape effect and plastic deformation effect in the bonding process.
Related Topics
Physical Sciences and Engineering
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Computer Science Applications
Authors
H. Fan, J. G Xu, K.Y. Sze,