Article ID Journal Published Year Pages File Type
553644 IERI Procedia 2012 6 Pages PDF
Abstract

Numerical simulation was carried out on the sintering process of the solar cell with boron back surface field (B-BSF) using the finite element analysis (FEA) software Solidwork Simulation, to analyze the bend problem and to obtain the distribution of residual stress. The impact was discussed on the thicknesses of silicon material and B-BSF on the bend level of the cell, and the stress state of the solar cells under different bend levels was investigated. The results reveal that the increasing sintering temperature causes increasing bow and residual stress but not remarkable, because B-BSF already has reached the yield stress to cause the plastic deformation. The thinner wafer will make the both bow and residual stress increase. When the thickness of the wafer was lower than 140 μm, there would be some damages occur near the electrode which was the location of residual stress concentration. If the thickness of wafer is below 6 μm, there may be some local damages occur in the region of the wafer near the electrode.

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Physical Sciences and Engineering Computer Science Information Systems