Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
563082 | Signal Processing | 2009 | 10 Pages |
Abstract
Recent computational methods of wafer defect detection often inspect Scanning Electron Microscope (SEM) images of the wafer. In this paper, we propose a kernel-based approach to multichannel defect detection, which relies on simultaneous acquisition of three different images for each sample in a SEM tool. The reconstruction of a source patch from reference patches in the three channels is constrained by a similarity criterion across the three SEM images. The improved performance of the proposed algorithm is demonstrated, compared to a single-channel kernel-based defect detection method.
Related Topics
Physical Sciences and Engineering
Computer Science
Signal Processing
Authors
Maria Zontak, Israel Cohen,