Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
5914588 | Journal of Structural Biology | 2012 | 5 Pages |
Abstract
New instrumentation for three-dimensional electron microscopy is facilitating an increase in the throughput of data collection and reconstruction. The increase in throughput creates bottlenecks in the workflow for storing and processing the image data. Here we describe the creation and quantify the throughput of a high-throughput infrastructure supporting collection of three-dimensional data collection.
Keywords
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Authors
Donald C. Shrum, Brent W. Woodruff, Scott M. Stagg,