| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 593094 | Colloids and Surfaces A: Physicochemical and Engineering Aspects | 2014 | 12 Pages |
Abstract
- Agglomeration reduction is demonstrated in metal oxide polishing slurries.
- Stabilization substantially maintains material removal rate during polishing.
- Stabilization improves filterability and reduces roughness of the polished surfaces.
- Formation of charged micelles is shown to be critical to agglomeration reduction.
Related Topics
Physical Sciences and Engineering
Chemical Engineering
Colloid and Surface Chemistry
Authors
Rebecca Dylla-Spears, Lana Wong, Philip E. Miller, Michael D. Feit, William Steele, Tayyab Suratwala,