| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 593198 | Colloids and Surfaces A: Physicochemical and Engineering Aspects | 2014 | 9 Pages |
Abstract
- Sn-3.0Ag-0.5Cu wetting on the inclined Ni substrate is performed at high temperature.
- Curve fitting for profiles of droplets are presented to calculate contact angles.
- Contact angle hysteresis with different inclinations of the substrate is discussed.
- Moving characteristics of the front and rear triple points are investigated.
- Surface Evolver is employed to simulate spreading behavior of the molten solder.
Related Topics
Physical Sciences and Engineering
Chemical Engineering
Colloid and Surface Chemistry
Authors
Bingsheng Xu, Zhangfu Yuan, Yan Wu,