| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 593245 | Colloids and Surfaces A: Physicochemical and Engineering Aspects | 2014 | 9 Pages |
Abstract
- A layer of PVP is coated onto copper nanoparticles to minimize their agglomeration.
- Stable colloidal copper nanoparticles were prepared and used to prepared a nanofluid.
- Convective heat transfer properties of a colloidal copper nanofluid were studied.
- The heat transfer coefficient increases with concentration of colloidal copper nanoparticles.
- Enhancement in the heat transfer coefficient was observed at different Reynolds numbers.
Related Topics
Physical Sciences and Engineering
Chemical Engineering
Colloid and Surface Chemistry
Authors
Prasad Gurav, S. Srinu Naik, Komel Ansari, S. Srinath, K. Anand Kishore, Y. Pydi Setty, Shirish Sonawane,