| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 611489 | Journal of Colloid and Interface Science | 2008 | 5 Pages |
In this work, the influence of atmospheric-pressure CHF3/Ar plasma treatment on surface dielectric properties of polyimide films was investigated using X-ray photoelectron spectroscopy (XPS), atomic force microscopy (AFM), and contact angle measurements. The dielectric characteristics of the films were studied using a dielectric spectrometer. From the results, it was found that the plasma treatment introduced fluorine functional groups onto the polyimide surfaces. F1s/C1s ratios of the polyimides were enhanced with the increase of plasma treatment time. Consequently, the fluorine groups led to a decrease of the surface free energy and dielectric constant of the polyimide films, which can largely be attributed to the decrease of the deformation polarizability or London dispersive component of surface free energy of the solid surface studied.
Graphical abstractThe dielectric constant was calculated according to the usual parallel plate capacitor formula. The dielectric-constant room-temperature dependence of the dielectric constants of the polyimide films on frequency is shown in the figure. It can be seen that the dielectric constant slightly decreased slightly with increasing inputted frequency when the temperature was kept constant.Figure optionsDownload full-size imageDownload as PowerPoint slide
