| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 611637 | Journal of Colloid and Interface Science | 2008 | 19 Pages |
Abstract
This review describes the uses of uniform particles (abrasives) and colloid chemical methods to develop a better understanding of the chemical-mechanical planarization (CMP) process.
Related Topics
Physical Sciences and Engineering
Chemical Engineering
Colloid and Surface Chemistry
Authors
E. MatijeviÄ, S.V. Babu,