| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 644508 | Applied Thermal Engineering | 2016 | 11 Pages |
•Micro-channels, plate-fin and spray cooling technologies are investigated in detail.•A review on pumped two-phase flow cooling technologies is presented.•Heat enhancements for pumped two-phase cooling technologies are discussed.•Macroscopic, microscopic–nanoscopic and hybrid heat enhancements are presented.
In this paper, different pumped two-phase flow cooling technologies for electronic components are presented. Since electronic components heat dissipation requirements are growing, cooling technologies have evolved from air cooled heat exchanger to technologies involving the use of single or two-phase refrigerants. This review focuses on three technologies that allow dissipation of heat flux over 100 W/cm2: Micro-channels, plate-fin and spray cooling. Macroscopic, microscopic–nanoscopic and hybrid heat enhancements for all three technologies are also presented.
