Experimental comparison between different configurations of PCM based heat sinks for cooling electronic components

The thermal control of electronic components is aimed at ensuring their use in a temperature range compatible with their performances. This paper presents an experimental study of the behavior of phase change materials (PCMs) as the cooling system for electronic devices. Four configurations are used to control the increase in the system temperature: pure PCM, PCM in a silicone matrix, PCM in a graphite matrix and pure PCM in a system of fins. Thermo-physical properties of different PCMs are determined and found to be desirable for application in this study. Solid liquid interface visualization and temperature evolution are employed to understand the mechanism of heat transfer during the different stages. Results indicated that the inclusion of PCM can lower component increase temperature and extends twice the critical time of the heat sink. The use of Graphite matrix filled by PCM showed more improvement on system thermal performance than silicon matrix. Also, for the same fraction of copper, it was found that incorporating long copper fins with suitable spacing into PCM, can enhance heat distribution into PCM leading to longer remain component temperature below the critical limit. This work therefore shows that the combination of PCM and long, well-spaced fins presents an effective means for thermal control of electronic devices.