Application of nanofluids in computer cooling systems (heat transfer performance of nanofluids)

Nanofluids are stable suspensions of nano fibers and particles in fluids. Recent investigations show that thermal behavior of these fluids, such as improved thermal conductivity and convection coefficients are superior to those of pure fluid or fluid suspension containing larger size particles. The use of enhanced thermal properties of nanofluids for the cooling of computer microchips is the main aim of this research. Base fluid used, was various compositions of a mixture of deionized water and ethylene glycol. Three nanoparticles of silica, alumina and titania were used, each with three different volumetric concentrations in the base fluid. The effect of the flow rate of nanofluid in the cooling process has also been investigated. Results show enhanced heat transfer in the cooling of the microchip as indicated in the considerable reduction of the operating temperature of processor when using the nanofluid as compared to application of pure fluid. As expected it was observed that an increase in the flow rate of the nanofluid resulted in decrease in the processor temperature. The largest decrease observed was for alumina nanofluid, which decreased processor temperature from 49.4 to 43.9 °C for 1.0% of volumetric concentration and flow rate of 1.0 L per minute when compared with the pure base fluid with the same flow rate. Results suggest that there should be a balance between volumetric concentration of nanoparticles and the flow rate to satisfy the economy and power consumption of cooling the system.

► Heat transfer coefficient of base fluid increases with addition of nanoparticles. ► The heat transfer coefficient is enhanced with increase in Reynolds number. ► Adding of nanoparticles resulted in lower processor's operating temperatures. ► Increasing flow rate of coolant decreased operating temperature of the processor.