| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 647519 | Applied Thermal Engineering | 2012 | 9 Pages |
A liquid CPU cooler has been designed and tested with the aim to achieve a cooling capacity of 200 W for a surface area of 8.24 cm2, commensurate with the integrated heat spreader dimensions of an Intel® Pentium® 4 Processor. The primary aim of the design was to develop thermal hardware components that can be manufactured simply and cost effectively. To this end, a miniature jet array waterblock and a tube bundle remote heat exchanger were employed since the bulk of their housings could be manufactured using low cost injection molding techniques which could significantly reduce the total system cost compared with conventional units. The system was capable of dissipating the required heat load and exhibited an overall thermal resistance of 0.18 K/W requiring approximately 1.5 W of hydraulic power. At maximum power the chip-to-air temperature difference was 45 °C which is adequately close to typical design thresholds. The influences of power loading and liquid volumetric flow rate are also discussed.
► We describe a liquid CPU cooling system. ► The cooling capacity is 200 W for a surface area of 8.24 cm2. ► The overall thermal resistance is 0.18 K/W. ► The system requires approximately 1.5 W of hydraulic power. ► The system is amenable to low cost manufacturing.
