| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 647842 | Applied Thermal Engineering | 2012 | 8 Pages |
Abstract
⺠A new shape-stabilized PCM with higher thermal conductivity is prepared. ⺠The material overcomes the packaging difficulty of traditional PCMs used in thermal control unit. ⺠The EG greatly improves thermal conductivity with little effect on latent heat. ⺠The material has high thermal stability and good heat storage/release performance. ⺠The effectiveness of the material for electronic device thermal control is proved.
Related Topics
Physical Sciences and Engineering
Chemical Engineering
Fluid Flow and Transfer Processes
Authors
Wen-long Cheng, Na Liu, Wan-fan Wu,