| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 647924 | Applied Thermal Engineering | 2011 | 9 Pages |
Abstract
⺠In this study we model a Flat Heat Pipe (FHP) designed for the cooling of electronic components. ⺠This model is a transient model, coupling 3D thermal and hydrodynamic models. ⺠The model makes it possible to obtain the FHP wall transient temperatures. ⺠Transient pressures, velocities and temperatures in liquid and vapor phases are also obtained. ⺠We conclude that FHP is more efficient for long than very short thermal cycles.
Related Topics
Physical Sciences and Engineering
Chemical Engineering
Fluid Flow and Transfer Processes
Authors
Souad Harmand, Raymond Sonan, Michel Fakès, Hamdy Hassan,