| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 648558 | Applied Thermal Engineering | 2009 | 5 Pages |
Abstract
The aim of this paper is to provide a methodical approach for architectural optimization of power microelectronic devices. Because critical parameters of electronic devices are linked with reliability, architectural optimization, selection of the geometrical parameters of device and optimization of these parameters by iteration method associated by numerical analysis of reliability have to be achieved. In this way, this paper discusses about a methodical and numerical approach for the optimization of reliability in electronic devices, in particular the influence of geometrical parameters on the device reliability.
Related Topics
Physical Sciences and Engineering
Chemical Engineering
Fluid Flow and Transfer Processes
Authors
Jean-Denis Mathias, Pierre-Marie Geffroy, Jean-François Silvain,