| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 648913 | Applied Thermal Engineering | 2008 | 14 Pages |
Abstract
By the validated theoretical analysis model, numerical investigation of heat transfer enhancements, such as thermal balls and thermal vias, in the board-level microelectronic component is also accomplished, and eventually, an extensive thermal design guideline is accordingly provided.
Related Topics
Physical Sciences and Engineering
Chemical Engineering
Fluid Flow and Transfer Processes
Authors
Hsien-Chie Cheng, Wen-Hwa Chen, Hwa-Fa Cheng,